The OPC Foundation and FieldComm Group announced an alliance to further advance process automation system multi-vendor interoperability and simplified integration by developing a standardized process automation device information model.
The CC-Link Partner Association (CLPA), in association with the OPC Foundation, has announced an OPC UA companion specification for the CLPA’s new “CSP+ for Machine” technology to further ease the implementation of Industry 4.0 type applications.
Microsoft has partnered with Hewlett Packard Enterprise (HPE), Honeywell, Mitsubishi, Rockwell, Siemens, Schneider, Beckhoff, Harting, and Leuze showing the Microsoft “Connected Factory” via 40 OPC UA enabled demo walls in their International Technology Centers.
See who’s on board with OPC UA. Testimonials from Sercos, CC-Link, PROFINET, EtherCAT, IO-Link, Powerlink, and CAN in Automation are featured here on why each organization is partnering with the OPC Foundation.
Microsoft has announced their contribution of an open-source, cross-platform OPC UA Global Discovery Server (GDS) to the OPC Foundation. The greatest value of an OPC UA GDS deployment is its certificate management capability thereby simplifying security.
Samsung Electronics, one of the largest manufacturers in the world, becomes a Corporate Member to enable an interoperable Industrial IoT edge platform in its manufacturing infrastructures, powered by the OPC UA framework.
Due to the relevance of OPC UA to Industrie 4.0 and German Industry, the BSI performed an in-depth security analysis of the OPC UA specifications and a selected reference implementation. An extensive analysis of the security functions in the specification of OPC UA confirmed that OPC UA was designed with a focus on security and does not contain systematic security vulnerabilities.
Welcome to the April edition of the OPC connect newsletter!
2017 has already started off by being a banner year in terms of OPC technology and marketing activities. I have attended and presented at numerous different events in the first three months of the year. 2017 is shaping up to be a very busy year for the OPC Foundation. We are eager to keep you abreast of the expansion of the OPC UA technology and progress made on the collaboration front. We appreciate you taking time out of your busy schedule to check out what we have been up to.
Two important Memorandums of Understanding were signed in recent months. First, OPC UA is finding itself used in applications beyond traditional manufacturing. In this case, commercial professional kitchens. Second, an MOU was signed with the VDMA Robotics organization. Here, OPC UA was chosen as the easiest route to M2M integration.