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OPC Foundation Joins APL Project Group

The OPC Foundation will support the development and promotion of an Advanced Physical Layer (APL) for industrial Ethernet, suitable for use in demanding applications and hazardous locations in the process industry.

Collaborations: umati // EUROMAP // PROFINET

Three new updates are available on the collaborations front. First, the VDMA and VDW have joined forces to promote the use and dissemination of OPC UA standards under the umati label. Second, the EUROMAP Companion Spec for plastics and rubber machines based on OPC UA is released. Third, an OPC UA Companion Spec for PROFINET is released.

FLC Corner – June 2020

The OPC Foundation, ODVA, and Sercos International are pleased to announce a collaboration to develop a new generation of a best-in-class motion technology for industry: OPC UA Motion. A new Working Group is tasked with specifying the motion facet of Field Level Communications (FLC) to enable inter-vendor operation for motion automation.

Exploring OPC UA Security Concepts

This paper explores what OPC UA Certificates are and what they provide, how they are used in OPC UA, and how they fit into the security ‘stack’ of OPC UA. Additionally, it examines OPC UA encryption methodology and the key concepts of a layered security model.

Specification for OPC UA Safety Release 1.00 Completed

The OPC UA Safety working group has achieved a key milestone publishing Release 1.00 of the specification for the interoperable communication standard for functional safety: OPC UA Safety “Part 15 OPC UA Core Specification”. OPC Foundation members are invited to participate in a co-funding project to develop a software stack.

Machine Vision Information-Model Based on OPC UA

The OPC Foundation’s vision for facilitating the creation of globally harmonized information models via OPC UA Companion Specifications reaches its first milestone and demonstrates the path forward to true semantic interoperability -as released by the VDMA Machine Vision Initiative.

OPC UA Companion Specification for MTConnect Released

The OPC Foundation, in conjunction with the MTConnect Institute, announce the release of the jointly developed “OPC Unified Architecture for MTConnect Companion Specification Part 1”. The MTConnect OPC UA Companion Specification expresses the MTConnect stream and device information models via the OPC UA modeling language.

DEXPI is Paving the Way to Process Industry 4.0

The Process and Instrumentation Diagram (P&ID) is the most important document used for designing and building a plant. The DEXPI initiative has developed a data format that supports the move from a document-centric to a data-centric approach -with the help of an OPC UA companion specification.