It is an honor and I am happy to send you my first “President’s Welcome” greeting! We all are pleased to announce that OPC UA is omnipresent in magazine articles, industry fairs, manufacturer events, conference contributions, social media, and more. OPC UA is rightly being called the key or enabler for Industrie 4.0, the Industrial Internet of Things (IIoT), the various initiatives from the USA (IIC), China (Made in China 2025), Korea (Manufacturing Industry Innovation 3.0), Japan (Industrial Value Chain Initiative) and others. I am therefore looking forward to the exciting times ahead and working together with you.
Intel recently rejoined the OPC Foundation to participate in the OPC UA Field Level Communication Steering Committee and help develop specifications that will enable OPC UA to seamlessly communicate with field devices. We view OPC UA as well positioned to provide communications solutions for smart manufacturing as well as other verticals.
One of our more popular posts was our OPC Frequently Asked Questions article. Since publishing that story, we have heard from readers with additional questions and challenges they were facing, so we thought it was time we share a “V2” with some more common questions and answers.
Another exciting edition of the OPC Connect newsletter has arrived. The OPC Foundation has been busy these past few months and the remainder of 2018 is shaping up to be no different. Learn about all of the activities, past and present, happening in North America and Europe, our new IPR Policy 2.1, and how to get involved with the OPC Foundation.
Thank you for taking time out from your busy day to read this edition of the OPC Connect newsletter.
Welcome to the August 2018 OPC Connect newsletter. The word is out… OPC UA continues to be recognized as the international communication and information standard for Industrie 4.0; end-users all across industrial segments and beyond are demanding OPC UA information interoperability from their suppliers. Collaborations with diverse organizations are pushing the release of companion specifications to enable the use of OPC UA in other vertical markets.
Read more and thank you for taking time out from your busy day to explore this edition of the OPC Connect newsletter.
Examples of the benefits of IIoT era open data sharing throughout the plant or factory shop-floor and the rest of the enterprise are easy to come by. What is not as obvious is how important (and difficult) it is to preserve and utilize the context of the shared data so systems can interpret and use the data they receive from 3rd party sources.
Welcome to this edition of the OPC Connect newsletter. Hannover 2018 in April was a smashing success, as was the recent OPC Day Europe. Everywhere you looked OPC UA was prominently displayed and being demonstrated showing commitment to OPC UA technology.
IIoT is not just a buzzword, but a real phenomenon that is being driven by standards organizations like OPC Foundation, OMAC and AMT. Both the PackML and the MTConnect companion specifications include standard OPC UA information models so that all machines look and act the same.
The months of April and May are shaping up to be a momentous time for the OPC Foundation. We will be exhibiting at Hannover Messe, Hall 9 – Booth A11, at the end of April for which excitement has grown to a fever pitch.
The long-anticipated OPC UA PubSub standard has been released expanding even further the breadth of applications for our technologies.
Finally, membership in the OPC Foundation has reached an all-time high due to demand from the industry for OPC UA enabled products. Is your company a member?
Please enjoy this edition of OPC Connect!