Editorial

President’s Welcome – September 2021

A warm welcome to you all,
I hope you enjoyed your summer vacation and had the opportunity to escape from work for a short while. So with renewed strength and refreshed spirit we can look forward to a productive, educational, and healthy autumn. Learn about the OPC Foundation’s activities in this issue of OPC Connect.

President’s Welcome – June 2021

Welcome,
First of all, I invite you to join us June 8-10 for OPC Day International. This major event is not to be missed. In this issue we also have news from: the OPC UA FX Working Group; OPC Hub ASEAN/Singapore; the Ethernet APL Project; special news for higher learning institutions (OPC UAcademic); and so much more. Thank you for reading!

OPC UA, Cybersecurity, and Smart Manufacturing

Data from automation systems used to stay put. It was produced by sensors, PLCs, and recorders; stored on local OPC servers and databases; and accessed by a few skilled operators and engineers. Although highly secure, data access was limited. All of that is changing.

President’s Welcome – March 2021

Welcome to OPC Connect in 2021. While we could talk plenty about our past activities, even more exciting are our future efforts. To start, learn how we are working to help users avoid ‘cloud vendor lock-in’. Furthermore, later this year, we plan to release an IIoT Starter Kit. Four big virtual events are planned over the coming months including an OPC Day and a first-ever virtual InterOP. Thank you for reading, and we look forward to working together this year!

ICONICS, OPC UA, and Digital Twins

One specific standard that has helped ICONICS to achieve its IoT goal more than any other standard over the years is OPC UA. ICONICS has created a ‘Digital Twins on Azure’ solution, built on Microsoft’s Azure platform, which provides virtual modeling capabilities for physical environments.

It’s All About Data Security

Secure data exchange between production and management levels is still something of a minefield. The following article addresses the aspects of secure cross-company communication by looking at an OPC UA-based solution from Softing.

President’s Welcome – December 2020

Welcome,
It’s the middle of December and therefore a good time to review the year and also to give an outlook for next year. Spontaneously, one might think “nothing happened this year – COVID-19 overshadowed everything and flattened all activities”. From the OPC Foundation’s point of view, one can give a different picture: COVID-19 did not stop the OPC Foundation but made us even more effective!

Commonalities Between American Football and OPC UA

While it may not be obvious, OPC UA and American football share common ground. Most importantly, both require smart action and good protection in rough environments. To address this, the ACI400 IIoT Edge device from METTLER TOLEDO provides secure data exchange using the OPC UA Companion Specification for simple static weighing.

Digital Transformation with Custom OPC UA Drivers

The push towards integrating any and all devices into your enterprise charges forward, with IIoT and Industrie 4.0 initiatives emerging in virtually every industry. But not every device has a ready-made, off-the-shelf driver for integration with other devices and other industrial systems.

President’s Welcome – September 2020

A warm welcome,
“Don’t let this Welcome Article start with Covid 19 again,” was my first thought. But in the end, the pandemic is THE issue that affects our entire business the most: Most trade shows have been cancelled or postponed to the middle of 2021, yet I have the feeling that we are all concentrating more on our daily work and that things will be solved faster.

Avoid Misconceptions: OPC UA and Weighing

Users of OPC UA Companion Specifications benefit from easy integration and interoperability. As an early adopter of the OPC UA Companion Specification for Weighing, METTLER TOLEDO has gained experience developing clients that support fast, functional OPC UA communication and offers insight into this experience in a new white paper.