The OPC Foundation, initiated by its member companies, is forming a new OPC UA for AI group, which is open to all its members. The… Read More »OPC UA for AI: Enhancing Automation with Artificial Intelligence
The FLC (Field Level Communications) Initiative is in the process of launching a second project phase as completion of the Controller-to-Controller (C2C) Minimum Viable System (MVS) approaches. The FLC Initiative’s Project Phase 2 will focus on the Controller-to-Device (C2D) use-case, and will operate for a term of 4 years.
This time my greeting does not start with a thoughtful look at crazy things happening in the world of standardization -but with something unexpectedly very pleasant. In preparing for the SPS trade fair, we noticed that the first OPC UA workgroup meeting was held on 3-7 November 2003 and that we were, therefore, celebrating 20 years of OPC UA standardization. We quickly bought confetti cannons and had a lot of fun at the OPC Foundation booth. Actually, come to think of it, it was crazy!
In light of Mr. Bryant’s upcoming retirement at the end of the year, the OPC Foundation would like to thank Mike Bryant for his outstanding 22 years in his role as Secretary of the OPC Foundation.
Over 40 participants have participated in the kick-off meeting of a new working group to develop an I/O Device Profile for OPC UA. Finally, the FLC Initiative will start phase 2 of the project at the beginning of 2024 with a focus on Controller-to-Device (C2D).
Good morning, good afternoon, good evening – wherever you are in the world!
OPC Unified Architecture (OPC UA) connects machines with each other, machines with services, and also services with each other. The LADS Hack-a-thon event in Waldbronn, Germany, further showed me that OPC UA connects people also!
A leading consumer goods company, P&G is also a global leader in the smart manufacturing domain through its efforts to drive innovation by using digital technologies, including OPC UA, in a concept they call “constructive disruption.”
At Hannover Fair 2023, the companies HARTING, Siemens, SAP and Microsoft are jointly demonstrating the value of interoperability leveraging IEC standards in several phases of a product’s lifecycle.
The Digital Twin Consortium (DTC) and the OPC Foundation have worked closely in several open-source reference implementation projects on GitHub and have agreed to collaborate even closer to accelerate the development and adoption of digital twin-enabling technologies.
At this year’s Smart Factory and Automation exhibition in Seoul, the OPC Foundation showcased its new multivendor UAFX-based C2C interoperability demonstration. Also, the Foundation is working with TIACC on a TSN test specification working group to further development of an interoperable ecosystem of TSN-compliant devices.