Industrial Interoperability with OPC UA and the AAS
At Hannover Fair 2023, the companies HARTING, Siemens, SAP and Microsoft are jointly demonstrating the value of interoperability leveraging IEC standards in several phases of a product’s lifecycle.
At Hannover Fair 2023, the companies HARTING, Siemens, SAP and Microsoft are jointly demonstrating the value of interoperability leveraging IEC standards in several phases of a product’s lifecycle.
The Digital Twin Consortium (DTC) and the OPC Foundation have worked closely in several open-source reference implementation projects on GitHub and have agreed to collaborate even closer to accelerate the development and adoption of digital twin-enabling technologies.
At this year’s Smart Factory and Automation exhibition in Seoul, the OPC Foundation showcased its new multivendor UAFX-based C2C interoperability demonstration. Also, the Foundation is working with TIACC on a TSN test specification working group to further development of an interoperable ecosystem of TSN-compliant devices.
The OPC Foundation is proud to announce, and congratulates, those elected to Board seats for 2023-2024. OPCF also welcomes the launch of the “.NET User Group” initiated by three companies represented on the OPC Foundation Board of Directors: ABB, Microsoft, and SAP. Plus: join OPCF at trade shows and events in 2023 with our Call-for-Sponsors.
New UAFX specifications have passed in-depth OPCF member reviews and extensive prototyping to ensure their implementations maintain cross-vendor interoperability. As such, automation vendors can now start adopting UAFX functionality in their offerings, and end-users can look forward to the advantages that UAFX-based field communications offer.
Analog Devices, Arm, Amazon Web Services (AWS), B&R Industrial Automation, Lattice Semiconductor, Schneider Electric and Texas Instruments, entered a collaboration to create a permissive, open source OPC UA over TSN (Time Sensitive Networking) stack on FreeRTOS.
The OPC Foundation (OPCF) and the FieldComm Group (FCG) are pleased to announce a collaboration to drive multi-vendor interoperability of instrumentation devices based on OPC UA FX (Field eXchange).
In addition to the OPC Foundation and FieldComm Group, new co-owners of the PA-DIM specification include ISA100 WCI, ODVA, PROFIBUS & PROFINET International, NAMUR, VDMA, and ZVEI.
A warm welcome to you all,
An incredible amount has happened in the last few months. I’ll start immediately to give an overview. There are multiple changes to the Board of Directors, including a new Chairperson. Trade show activities have ramped up from 0 to 100. And collaboration is top-of-mind with more announcements to come later in the year.
The growing diversity of the OPC Foundation Board of Directors reflects the expanding role OPC UA plays in OT and IT. Dr. Holger Kenn, Microsoft, has been elected as Chairperson.