Good morning, good afternoon, good evening – wherever you are in the world!
OPC Unified Architecture (OPC UA) connects machines with each other, machines with services, and also services with each other. The LADS Hack-a-thon event in Waldbronn, Germany, further showed me that OPC UA connects people also!
A leading consumer goods company, P&G is also a global leader in the smart manufacturing domain through its efforts to drive innovation by using digital technologies, including OPC UA, in a concept they call “constructive disruption.”
At Hannover Fair 2023, the companies HARTING, Siemens, SAP and Microsoft are jointly demonstrating the value of interoperability leveraging IEC standards in several phases of a product’s lifecycle.
The Digital Twin Consortium (DTC) and the OPC Foundation have worked closely in several open-source reference implementation projects on GitHub and have agreed to collaborate even closer to accelerate the development and adoption of digital twin-enabling technologies.
At this year’s Smart Factory and Automation exhibition in Seoul, the OPC Foundation showcased its new multivendor UAFX-based C2C interoperability demonstration. Also, the Foundation is working with TIACC on a TSN test specification working group to further development of an interoperable ecosystem of TSN-compliant devices.
The OPC Foundation is proud to announce, and congratulates, those elected to Board seats for 2023-2024. OPCF also welcomes the launch of the “.NET User Group” initiated by three companies represented on the OPC Foundation Board of Directors: ABB, Microsoft, and SAP. Plus: join OPCF at trade shows and events in 2023 with our Call-for-Sponsors.
New UAFX specifications have passed in-depth OPCF member reviews and extensive prototyping to ensure their implementations maintain cross-vendor interoperability. As such, automation vendors can now start adopting UAFX functionality in their offerings, and end-users can look forward to the advantages that UAFX-based field communications offer.
Analog Devices, Arm, Amazon Web Services (AWS), B&R Industrial Automation, Lattice Semiconductor, Schneider Electric and Texas Instruments, entered a collaboration to create a permissive, open source OPC UA over TSN (Time Sensitive Networking) stack on FreeRTOS.
The OPC Foundation (OPCF) and the FieldComm Group (FCG) are pleased to announce a collaboration to drive multi-vendor interoperability of instrumentation devices based on OPC UA FX (Field eXchange).
In addition to the OPC Foundation and FieldComm Group, new co-owners of the PA-DIM specification include ISA100 WCI, ODVA, PROFIBUS & PROFINET International, NAMUR, VDMA, and ZVEI.