When the OPC Foundation was asked by we.conect to take part in the first Industrial IoT Hackathon, we were very excited and jumped on board right away. Participants of the IIoT Hackathon had to find a real-world problem and come up with a solution in 24 hours. In most of the cases, OPC UA technology was used.
In this key position, the Chair manages the strategic and tactical directives of the Board of Directors and ensures the marketing, technical, and overall business activities of the OPC Foundation consistently align with its vision and objectives.
PubSub enables further adoption of OPC UA at the deepest levels of the shop-floor where controllers, sensors, and embedded devices typically require optimized, low power, and low-latency communications on local networks. It is also is relevant for cloud connected architectures.
On April 3, 2018, the OPC Foundation (OPCF) Board of Directors voted unanimously to adopt a new Intellectual Property Rights (IPR) Policy. We have simplified and improved our terms, following industry best practices. The new policy and will be binding on all OPCF members effective May 9, 2018.
The OPC UA for IEC 61850 Companion Specification was created to support the integration of electrical aspects into an industrial plant. It defines an OPC UA Information Model to represent electrical substation automation systems. The focus is on data exchange between a gateway and the devices that control electrical networks.
The OPC Foundation has partnered with many consortia for the primary purpose of developing an OPC UA companion specification. This allows the consortia partner members and the OPC Foundation members to take advantage of the rich feature set of the OPC UA technology providing data exchange services from the lowest level devices into the cloud.
The OPC Foundation and FieldComm Group announced an alliance to further advance process automation system multi-vendor interoperability and simplified integration by developing a standardized process automation device information model.
The CC-Link Partner Association (CLPA), in association with the OPC Foundation, has announced an OPC UA companion specification for the CLPA’s new “CSP+ for Machine” technology to further ease the implementation of Industry 4.0 type applications.
Microsoft has partnered with Hewlett Packard Enterprise (HPE), Honeywell, Mitsubishi, Rockwell, Siemens, Schneider, Beckhoff, Harting, and Leuze showing the Microsoft “Connected Factory” via 40 OPC UA enabled demo walls in their International Technology Centers.
See who’s on board with OPC UA. Testimonials from Sercos, CC-Link, PROFINET, EtherCAT, IO-Link, Powerlink, and CAN in Automation are featured here on why each organization is partnering with the OPC Foundation.