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Field Level Communications Corner – June 2026

    OPC UA FX Advances Toward Controller-to-Device (C2D) Communication and SPS 2026 Multi-Vendor Demonstration

    Following the successful completion of the OPC UA FX Controller-to-Controller (C2C) specifications, the FLC technical working groups are right now preparing a release candidate with extensions to support Controller-to-Device (C2D) communication and seamless integration of motion devices, remote I/O systems, sensors, actuators, and other field devices.

    In parallel with the standardization activities, extensive prototyping efforts are underway across the OPC UA FX ecosystem. These implementations leverage both commercial SDKs and open-source protocol stacks to validate key C2D concepts, engineering workflows, and interoperability mechanisms in real-world environments. The resulting prototypes provide valuable feedback to the working groups, helping to refine and validate the evolving specifications while demonstrating the practical feasibility of a unified, secure, and scalable industrial communication infrastructure.

    To showcase the progress achieved by both the specification and prototyping activities, a new OPC UA FX multi-vendor demo wall is being prepared for SPS 2026. The exhibit will bring together controllers, field devices, and edge applications in a single interoperable system architecture, demonstrating how OPC UA FX enables seamless communication from the field level to edge and cloud. Visitors will experience a range of Industry 4.0 use cases that highlight the benefits of open, secure, and vendor-independent communication, including simplified system integration, improved scalability, and enhanced operational flexibility.

    Evaluation boards enabling the development of OPC UA FX field devices

    SPS Italy

    Representatives of the Field Level Communications were actively on site at SPS Italia 2026 in Parma, engaging closely with partners, end users, and technology providers while supporting a series of live demonstrations that highlighted the latest advancements in industrial interoperability. The strong interest around multi-vendor communication, functional safety, and scalable cloud connectivity underscored the growing momentum behind OPC UA technologies, and further details on these demonstrations and their impact can be found in the dedicated article within this newsletter.

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